GaN Power HEMT Products
GaNPower International is proud to offer discrete GaN power devices, GaN/silicon copackaged IC and all-GaN power ICs. We currently offer qualified devices (in production) as well as limited engineering samples in stock for 650V and 1200V with current capability ranges from 8A to 60A. The devices and ICs come in several packages including TO-220, TO-252, TO263, DFN and LGA. In addition to GaN devices and IC, we also offer power system solutions with GaNPower patented technologies that take advantage of the high frequency and high efficiency switching characteristics of GaN.
All discrete GaNFETs are single-die E-mode devices with threshold voltage about 1.4V.
Discrete GaNFET 650 V series
Discrete GaNFET 900V series
Discrete GaNFET 1200V series
GaNPowerICTM (GaN Power IC)
GaNPower Evaluation Board
Bare Dies of GaNFET and All-GaN-IC
Further Information
Important Notice – Unless expressly approved in writing by an authorized representative of GaNPower, GaNPopwer components are not designed, authorized or warranted for use in lifesaving, life sustaining, military, aircraft, or space applications, nor in products or systems where failure or malfunction may result in personal injury, death, or property or environmental damage. The information given in this document shall not in any event be regarded as a guarantee of performance. GaNPower hereby disclaims any or all warranties and liabilities of any kind, including but not limited to warranties of non-infringement of intellectual property rights. All other brand and product names are trademarks or registered trademarks of their respective owners. Information provided herein is intended as a guide only and is subject to change without notice. The information contained herein or any use of such information does not grant, explicitly, or implicitly, to any party any patent rights, licenses, or any other intellectual property rights. All rights reserved.
Data Source – Data here are based on recent tests but all parameters may not be up to date. Actual final test data from packaging production are available for selected customers upon request.
*The following devices are included in the IC section, as they utilize regular ICs.