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Why GaN
Materials for Power Devices
Advantages of using GaN Power Devices
Silicon
First generation power devices material
SiC
Second generation power devices materia
GaN
Third generation power devices material
Manufacturing Cost
SiC power devices have a much higher manufacturing cost than silicon and GaN power devices, SiC power devices will be used mostly in high voltage and high power applications
Right now, GaN power devices manufacturing cost is slightly higher than silicon power devices. However, thanks to the improvement of technology and increased adoption in various applications, GaN devices are projected to cost less than silicon devices in the near future
GaN Material Advantages
GaN Power Devices Brings New Opportunities
Silicon has reached the bottleneck for further performance / efficiency improvements 1
Break through innovation bottlenecks by substituting silicon with GaN for power devices 2
GaN power devices not only go far beyond silicon in performance, they also open the door to opportunities that were deemed impossible in the past using silicon technology.
Advantages of using GaN Power Devices
High switching frequency with lower total costs!
High frequency makes it is possible to dramatically reduce the manufacturing cost by lower transistor cost and using much smaller passive elements. It also means the power electronics system that uses GaN transistors can achieve an unparalleled power density with a much smaller volume and light weight
Also, GaN material’s outstanding thermal property allows smaller or even no heat sink, further reduces the size and weight and lowers the total cost
Our Products
Our initial products will be focusing on power supplies used in consumer electronics and sustainable clean energy applications. |
Our power supplies will feature the latest technology with GaN HEMTs transistors that are designed by GaNPower.